Overview

    The Model 200IR Mask Aligner is a bench top system that is a cost-effective alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. It has an alignment module which features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and z-axis.

   This Model features a dependable OAI light source that provides collimated UV light in Near or Deep UV using lamps ranging in power from 200 to 2000 watts. Dual-sensor, optical feedback loops are linked to the constant intensity controller to provide control of exposure intensity within ±2% of the desired intensity. Changes may be made to the UV wavelength quickly and easily. The Model 200IR Mask Aligner is a flexible, economic solution for any entry-level mask alignment and UV exposure application for MEMS, Microfluidics and NIL.

Benefits

•Requires minimal clean room space.

•Accurate alignments to 1 micron.

•Easily accommodates a wide variety of substrates and masks.

•Backside mask alignment of IR transparent wafers with accuracy up to 3-5 microns.

•Highly collimated, uniform UV light.

Applications

   The system used in MEMS, NIL, Microfluidics, Nanotechnology, II-VI & III-V device fabrication, Multi-level resist processing, LCD and FED displays, MCM's, Thin film devices, Solar cells, SAW devices.