(iBond 5000)

Overview

Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.

Wire bonding offers some major advantages, including a large existing infrastructure, programming flexibility, and low cost. Continuing advances in wire bonding technology with increased process integration will enable this process to continue meeting the majority of semiconductor interconnect requirements for many years to come.

Working principle

The critical steps in the wire bonding process include achieving reliable bonds (first bond, second bond, and tail bonds), maintaining desired loops, and positioning the bonds accurately. The wire is attached at both ends using a combination of downward pressure, ultrasonic energy, and in some cases heat, to make a weld.