(WS-400BZ)​​​​​

Overview​

Spin coating is a procedure used to deposit uniform thin ​films onto flat substrates. Usually a small amount of coating material is applied on the center of the substrate, which is either spinning at low speed or not spinning at all. The substrate is then rotated at high speed in order to spread the coating material by centrifugal force.

Rotation is continued while the fluid spins off the edges of the substrate, until the desired thickness of the film is achieved. The applied solvent is usually volatile, and simultaneously evaporates. The higher the angular speed of spinning, the thinner the film. The thickness of the film also depends on the viscosity and concentration of the solution, and the solvent.

Applications

Spin coating is widely used in microfabrication of functional oxide layers on glass or single crystal substrates, where it can be used to create uniform thin films with Nano scale thicknesses. It is used intensively in photolithography, to deposit layers of photoresist.

Features

• ​Ability to store multiple programs.
• Closed loop motor control.
• Vacume substrate hold-down interlock with adjustable set point.
• Step time resolution of 0.1 second.
• Time, rpm, and Acceleration/Deceleration are programmable per step.